ICCC 2013

July 8-10, 2013
Tihany, Hungary


Authors' Schedule


Venue


Next Events

IEEE 9th International Conference on Computational Cybernetics

Welcome to ICCC 2013!

Authors are welcome to submit original and unpublished papers and attend the IEEE 9th International Conference on Computational Cybernetics to be held on July 8-10, 2013 in Tihany, Hungary.

Committees

Honorary Chair

Lotfi A. Zadeh, University of Berkeley, USA

Honorary Committee

William Gruver, Simon Fraser University, Canada
Fumio Harashima, Tokyo Metropolitan University, Japan
Tsu-Tian Lee, Chung Yuan Christian University, Taiwan

Steering Committee

Dimitar Filev, Ford Motor Company, USA
Toshio Fukuda, University of Nagoya, Japan
Keith Hipel, University of Waterloo, Canada
Witold Pedrycz, University of Alberta, Canada
Vincenzo Piuri, Universita' degli Studi di Milano, Italy
Bogdan M. Wilamowski, Auburn University, USA

General Chair

Imre J. Rudas, Óbuda University, Hungary

General Co-chairs

C. L. Philip Chen, University of Macau. Macau
Kaoru Hirota, Tokyo Institute of Technology

Technical Program Chair

Shun-Feng Su, NTUST, Taiwan

Technical Program Co-chairs

Tamás Haidegger, Óbuda University, Hungary
Sam Kwong, City University of Hong Kong, China
Wen-June Wang, NCU, Taiwan

Organizing Committee Chair

János Fodor, Óbuda University, Hungary

Organizing Committee Co-chairs

Róbert Fullér, Óbuda University, Hungary
Ladislav Madarász, Technical University of Košice, Slovakia
Liberios Vokorokos, Technical University of Košice, Slovakia

Local Arrangement Chair

József Gáti, Óbuda University, Hungary

Award Committee Chair

Annamária R. Várkonyi Kóczy, Óbuda University, Hungary

Financial Chair

Márta Takács, Óbuda University, Hungary

Special Session and Student Activity Chair

László Horváth, Óbuda University, Hungary

Publication Chair

Anikó Szakál, Óbuda University, Hungary

Publicity Chair

Chih-Min Lin, Yuan Ze University, Taiwan

Secretary General

Anikó Szakál, Óbuda University, Hungary

Joint Event


Organizers


Sponsors


Technical Sponsor


IEEE Publication